Packaging and Assembly Technologies
Stellar Industries Corp. offers Packaging and Assembly Technology through their parent company. Various Mounting and Packaging equipment are ready for R&D and Production volumes.
- Pick-place die-bonding Equipment for high precision bonding: Multiple pick and place die bonders from different manufacturers. Die bonding with Forming gas or Formic Acid available.
- Solder material: Pre-deposited AuSn, SnAgCu, other solders available upon request
- Submounts/heatsinks in various size: CuW, AlN, BeO, DBC cooler, All Cu cooler, etc.
Packaging/Assembly Service Capabilities
- Vacuum soldering equipment: Multiple reflow ovens available. Forming gas, Formic Acid, Plasma cleaning also available
- Solder material: AuSn, SnAgCu, InAg, BiSnAg, In, other soldering processes available upon request
- Wirebonder: Multiple wirebonders available. Thin wire to heavy gauge wire
- Available wires: 1.5mil/2mil Au, Thick Al, Cu, CuCorAl wire, other wires available upon request
- Other equipment: Laser engraving or Serialization