Direct Bond Copper Guidelines
Ceramic Types Available
- Al2O3
- 96%
- 99.5%
- 99.6%
- Sapphire
- 100% Al2O3
- BeO
- 99.5%
- AlN
- 170W/mK
- 170W/mK
Geometric Information
- Standard Direct Bond Copper Options Available
96% Al2O3 | Alumina
Ceramic Thickness | 0.005″ [0.127mm] Cu | 0.008″ [0.203mm] Cu | 0.012″ [0.305mm] Cu |
---|---|---|---|
0.010″ [0.254mm] | X | X | |
0.015″ [0.381mm] | X | X | |
0.025″ [0.635mm] | X | ||
0.040″ [1.016mm] | X | X |
96%, 99.5%, 99.6% & ZtA (Zirconium toughened Alumina), & Sapphire: Custom bonded ceramic and copper thickness available upon request
BeO | Beryllium Oxide
Ceramic Thickness | 0.005″ [0.127mm] Cu | 0.008″ [0.203mm] Cu | 0.012″ [0.305mm] Cu |
---|---|---|---|
0.025″ [0.635mm] | X | ||
0.040″ [1.016mm] | X |
Custom bonded ceramic and copper thicknesses available upon request
AlN | Aluminum Nitride
Ceramic Thickness | 0.005″ [0.127mm] Cu | 0.008″ [0.203mm] Cu | 0.012″ [0.305mm] Cu |
---|---|---|---|
0.015″ [0.381mm] | X | X | |
0.025″ [0.635mm] | X | ||
0.040″ [1.016mm] | X | X |
Custom bonded ceramic and copper thicknesses available upon request
- Design Constraints and Tolerances
- Finished Ceramic [only] Thickness
- Lapped: Standard to ±0.001”[±0.25mm], Special to ±0.0005”[±0.0127mm]
- As Fired: ±10%
- Finished Overall Direct Bond Copper Thickness [Cu both sides or single side]
- Lapped or Etched to ±0.002”[±0.05mm]
- As Fired: +7%/-10%
- Finished Ceramic [only] Thickness
-
- Pattern Space & Trace Requirements
Copper Thickness | Minimum Space/Trace | Space/Trace Tolerance |
---|---|---|
0.002″ [0.05mm] | 0.006″ [0.152mm] | ±0.002″ [±0.05mm] |
0.003″ [0.075mm] | 0.008″ [0.203mm] | ±0.002″ [±0.05mm] |
0.004″ [0.10mm] | 0.009″ [0.229mm] | ±0.003″ [±0.075mm] |
0.005″ [0.127mm] | 0.010″ [0.254mm] | ±0.004″ [±0.10mm] |
0.008″ [0.203mm] | 0.013″ [0.330mm] | ±0.006″ [±0.152mm] |
0.010″ [0.254mm] | 0.015″ [0.381mm] | ±0.007″ [±0.178mm] |
0.012″ [0.305mm] | 0.017″ [0.432mm] | ±0.008″ [±0.203mm] |
Traces are measured at the top of the pads. Spaces are measured at the bottom.
-
- Finished Part Metal Pullback Requirements
- From Diced Edge: 0.005”±0.005”[0.127mm±0.127mm]
- From Laser Scribe & Snap Edge: 0.010”±0.005”[0.254mm±0.127mm]
- A smaller Critical Edge pullback can be offered on one edge (Cu thickness dependent)
- Front to Back Alignment
- Tolerance: ±0.005”
- Tolerance: ±0.005”
- Finished Part Metal Pullback Requirements
Additional Options
- Proprietary Copper Filled Vias
- Ceramic Options
- 96% Al2O3
- 99.6% Al2O3
- BeO
- Ceramic Thickness Requirement
- Preferred: 0.040” [1mm]
- Optional: 0.030” [0.762mm]
- Via Hole Diameter Requirement
- Preferred: 0.040” [1mm]
- Optional: 0.030” [0.762mm]
- Copper Thickness Requirement
- 0.012” [0.30mm] Both Sides
- Minimum Distance Requirement
- Via Edge to Via Edge or to Finished Part Edge equal to via diameter
- Minimum Capture Pad Over Via Requirement
- 0.015” [0.381mm] all around filled Via
- Ceramic Options
- Flying Direct Bonded Lead Technology
- Lead Options
- Single Edge and Double [Opposite] Edges
- Bonded both sides or one side
- Ceramic Options
- 96% Al2O3
- 99.6% Al2O3
- BeO
- Copper Thickness Requirement
- 0.010” [0.254mm]
- 0.012” [0.30mm]
- Lead Requirement
- 0.350” [8.89mm] MAX Length
- 0.050” [1.27mm] MIN Width
- Tie Bars
- Excluded from Lead length & Width limits
- Design dependent
- Customer removed
- Custom Options
- Available upon request. Can be provided with filled Vias as well.
- Lead Options
- Stress Relief Dimpling
- Options
- Standard or customer specific options are both available
- Tolerance
- Dimples may or may not fully resolve and are not held to tolerance
- Dimples may or may not fully resolve and are not held to tolerance
- Options
Finish Options
- Bare Copper
- Packaging
- Vacuum sealed with a desiccant packet to reduce possible oxidation
- Packaging
- Electroless Plating
- Standards
- Mil-C-26074E, Class I (Ni)
- Mil-G-45204C, Type III, Grade A (Au)
- Nickel (Phosphorous)
- Standard Thickness: 100-300µ-in
- Custom thicknesses available
- Gold (over Ni)
- Standard Thickness: 2-6µ-in.
- Design requirements dependent
- Solderable and Wire Bondable
- Gold thickness may vary based on requirements
- Customer Specified Options
- Available upon request
- Standards
- Proprietary Selective AuSn Deposition
- Plating Requirement
- A Ni/Au plated finish under the AuSn is required
- Single Critical Edge Metal Pullback Option
- Copper thickness dependent
- Standard Options
- Available from 3-7µm with a Platinum barrier underneath
- Custom Options
- Available upon request
- Plating Requirement
- Laser Ablated Solder Stops/Dams
- Plating Requirement
- Plating is required
- Ni/Au plated finish is preferred
- Ni only accepted
- Process with Ni and Au Plating
- Gold is ablated away to expose nickel which oxidizes
- Process with Ni only Plating
- Nickel is ablated away to expose copper which oxidizes
- Nickel is ablated away to expose copper which oxidizes
- Plating Requirement
Singulate Options
- Dice to Final Size
- Array Requirement
- A dicing lane based on ceramic thickness required between parts
- Length & Width Tolerance
- Standard: ±0.002” [±0.05mm]
- Up to 0.040” [1mm] thick ceramic
- Custom Options
- Available upon request
- Array Requirement
- Laser Machine to Final Size
- Array Requirement
- Used for designs that cannot be diced complete
- 0.100” [2.54mm] between parts required
- Length & Width Tolerance
- Ceramic thickness and design dependent
- Custom Options
- Available upon request
- Array Requirement
- Laser Scribe and Snap to Final Size
- Array Requirement
- No spacing between parts is required
- Length & Width Tolerance
- Standard: ±0.005” [±0.127mm]
- Up to 0.040” [1mm] thick ceramic
- Edge Quality
- Edges may have a scalloped effect
- Custom Options
- Available upon request.
- Can offer scribed, but not snapped depending on ceramic thickness
- Array Requirement