Direct Bond Copper Guidelines

Ceramic Types Available

  • Al2O3
    • 96%
    • 99.5%
    • 99.6%
  • Sapphire
    • 100% Al2O3
  • BeO
    • 99.5%
  • AlN
    • 170W/mK

Geometric Information

  • Standard Direct Bond Copper Options Available

96% Al2O3 | Alumina

Ceramic Thickness 0.005″ [0.127mm] Cu 0.008″ [0.203mm] Cu 0.012″ [0.305mm] Cu
0.010″ [0.254mm] X X
0.015″ [0.381mm] X X
0.025″ [0.635mm] X
0.040″ [1.016mm] X X

96%, 99.5%, 99.6% & ZtA (Zirconium toughened Alumina), & Sapphire: Custom bonded ceramic and copper thickness available upon request

BeO | Beryllium Oxide

Ceramic Thickness 0.005″ [0.127mm] Cu 0.008″ [0.203mm] Cu 0.012″ [0.305mm] Cu
0.025″ [0.635mm] X
0.040″ [1.016mm] X

Custom bonded ceramic and copper thicknesses available upon request

AlN | Aluminum Nitride

Ceramic Thickness 0.005″ [0.127mm] Cu 0.008″ [0.203mm] Cu 0.012″ [0.305mm] Cu
0.015″ [0.381mm] X X
0.025″ [0.635mm] X
0.040″ [1.016mm] X X

Custom bonded ceramic and copper thicknesses available upon request

  • Design Constraints and Tolerances
    • Finished Ceramic [only] Thickness
      • Lapped: Standard to ±0.001”[±0.25mm], Special to ±0.0005”[±0.0127mm]
      • As Fired: ±10%
    • Finished Overall Direct Bond Copper Thickness [Cu both sides or single side]
      • Lapped or Etched to ±0.002”[±0.05mm]
      • As Fired: +7%/-10%
    • Pattern Space & Trace Requirements
Copper Thickness Minimum Space/Trace Space/Trace Tolerance
0.002″ [0.05mm] 0.006″ [0.152mm] ±0.002″ [±0.05mm]
0.003″ [0.075mm] 0.008″ [0.203mm] ±0.002″ [±0.05mm]
0.004″ [0.10mm] 0.009″ [0.229mm] ±0.003″ [±0.075mm]
0.005″ [0.127mm] 0.010″ [0.254mm] ±0.004″ [±0.10mm]
0.008″ [0.203mm] 0.013″ [0.330mm] ±0.006″ [±0.152mm]
0.010″ [0.254mm] 0.015″ [0.381mm] ±0.007″ [±0.178mm]
0.012″ [0.305mm] 0.017″ [0.432mm] ±0.008″ [±0.203mm]

Traces are measured at the top of the pads. Spaces are measured at the bottom.

    • Finished Part Metal Pullback Requirements
      • From Diced Edge: 0.005”±0.005”[0.127mm±0.127mm]
      • From Laser Scribe & Snap Edge: 0.010”±0.005”[0.254mm±0.127mm]
      • A smaller Critical Edge pullback can be offered on one edge (Cu thickness dependent)
    • Front to Back Alignment
      • Tolerance: ±0.005”

Additional Options

  • Proprietary Copper Filled Vias
    • Ceramic Options
      • 96% Al2O3
      • 99.6% Al2O3
      • BeO
    • Ceramic Thickness Requirement
      • Preferred: 0.040” [1mm]
      • Optional: 0.030” [0.762mm]
    • Via Hole Diameter Requirement
      • Preferred: 0.040” [1mm]
      • Optional: 0.030” [0.762mm]
    • Copper Thickness Requirement
      • 0.012” [0.30mm] Both Sides
    • Minimum Distance Requirement
      • Via Edge to Via Edge or to Finished Part Edge equal to via diameter
    • Minimum Capture Pad Over Via Requirement
      • 0.015” [0.381mm] all around filled Via
  • Flying Direct Bonded Lead Technology
    • Lead Options
      • Single Edge and Double [Opposite] Edges
      • Bonded both sides or one side
    • Ceramic Options
      • 96% Al2O3
      • 99.6% Al2O3
      • BeO
    • Copper Thickness Requirement
      • 0.010” [0.254mm]
      • 0.012” [0.30mm]
    • Lead Requirement
      • 0.350” [8.89mm] MAX Length
      • 0.050” [1.27mm] MIN Width
    • Tie Bars
      • Excluded from Lead length & Width limits
      • Design dependent
      • Customer removed
    • Custom Options
      • Available upon request.  Can be provided with filled Vias as well.
  • Stress Relief Dimpling
    • Options
      • Standard or customer specific options are both available
    • Tolerance
      • Dimples may or may not fully resolve and are not held to tolerance

Finish Options

  • Bare Copper
    • Packaging
      • Vacuum sealed with a desiccant packet to reduce possible oxidation
  • Electroless Plating
    • Standards
      • Mil-C-26074E, Class I (Ni)
      • Mil-G-45204C, Type III, Grade A (Au)
    • Nickel (Phosphorous)
      • Standard Thickness: 100-300µ-in
      • Custom thicknesses available
    • Gold (over Ni)
      • Standard Thickness: 2-6µ-in.
      • Design requirements dependent
    • Solderable and Wire Bondable
      • Gold thickness may vary based on requirements
    • Customer Specified Options
      • Available upon request
  • Proprietary Selective AuSn Deposition
    • Plating Requirement
      • A Ni/Au plated finish under the AuSn is required
    • Single Critical Edge Metal Pullback Option
      • Copper thickness dependent
    • Standard Options
      • Available from 3-7µm with a Platinum barrier underneath
    • Custom Options
      • Available upon request
  • Laser Ablated Solder Stops/Dams
    • Plating Requirement
      • Plating is required
      • Ni/Au plated finish is preferred
      • Ni only accepted
    • Process with Ni and Au Plating
      • Gold is ablated away to expose nickel which oxidizes
    • Process with Ni only Plating
      • Nickel is ablated away to expose copper which oxidizes

Singulate Options

  • Dice to Final Size
    • Array Requirement
      • A dicing lane based on ceramic thickness required between parts
    • Length & Width Tolerance
      • Standard: ±0.002” [±0.05mm]
      • Up to 0.040” [1mm] thick ceramic
    • Custom Options
      • Available upon request
  • Laser Machine to Final Size
    • Array Requirement
      • Used for designs that cannot be diced complete
      • 0.100” [2.54mm] between parts required
    • Length & Width Tolerance
      • Ceramic thickness and design dependent
    • Custom Options
      • Available upon request
  • Laser Scribe and Snap to Final Size
    • Array Requirement
      • No spacing between parts is required
    • Length & Width Tolerance
      • Standard: ±0.005” [±0.127mm]
      • Up to 0.040” [1mm] thick ceramic
    • Edge Quality
      • Edges may have a scalloped effect
    • Custom Options
      • Available upon request.
      • Can offer scribed, but not snapped depending on ceramic thickness

Download a copy of our Direct Bond Copper Guidelines

DBC Design Guidelines