| • 3, 5, 8, 10 and 12 mil OFHC Copper foil |
| • Substrate sizes up to 5"x7" |
| • Substrate thickness of .015", .025" and .040" |
| • Custom thickness available |
| • Precision lapped substrates for improved camber and flatness control |
| • Laser scribed or Diamond Sawn edges |
| • Laser drilled or ultrasonically drilled holes |
| • Patterning to as fine as 10 mil lines and spaces |
| • Frontside to backside pattern alignments |
| • High thermal conductivity |
| • High electrical conductance |
| • Excellent adhesion |
| • Economical |
| • Hermetic packaging |
| • Excellent for brazing and soldering |
| • High temperature (1000 degrees C) |
| • Reworkable |
| • Plateable with Nickel and Gold |
| • Wirebondable |
| • Direct chip mounting |
| • Multilayer Construction |
| • Solid filled feed-thrus |
| • Lead frame attachments |
