Lapping ::
Parallel plate and surface lapping holding size to as fine as +/- 50 millionths of an inch and flatness specifications measured in the helium light band range. |
Polishing ::
Proprietary polishing processes offers the finest 2 microinch aluminum nitride surfaces available for demanding thin film applications. Proprietary cleaing and exclusion of alkaline cleaners insure AlN surface integrity for improved thin film adhesion. AlN, BeO, & Al2O3 structure up to 6" x 6" sizes can be accomodated. |
Laser Drilling & Scribing::
Laser machining on AlN without leaving conductive aluminum slag can be achieved with 0.002" absolute and relative resolution. |
Diamond Dicing::
Full 5" capacity DISCO diamond dicing capabilities to 0.0002" absolute accuracies are achievable |
BeO Clean-Air Firing & Alumina Annealing:
High temperaure environmental furnaces to clean-air fire BeO and sinter fire alumina to reconstitute bulk material properties and anneal laser surface damage. |
