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| Laser Diode Submounts :: Al2O3, AlN & BeO Thin Film Metalized |
| Precision metalized submounts on high thermal conductivity ceramics for laser diode submount applications, Available on 2µ-inch polished AlN and BeO ceramics with thin film metalization for improved Au/Sn and Au/Ge preform soldering of fragile diode devices. Improved edge quality with diamond machined edges to permit precision planar alignment in diode mounting. |
| Substrate Material |
| Aluminum Nitride: |
170 W/mK Thermal Conductivity
200 W/mK Available on special orders |
| Beryllium Oxide: |
280 W/mk Thermal Conductivity |
| Alumina Oxide: |
20-30 W/mK Thermal Conductivity |
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| Surface Finish: |
| Less than 2µ-in. Polished Surfaces. |
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| Metalizations |
| Thin Film: |
Ti/Pt/Au: |
1000Â/1500Â/5000Â |
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Ti/Ni/Au: |
1000Â/1500Â/100µin |
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NiCr/Ni/Au: |
300Â/1500Â/100µin |
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NiCr/Cu/Ni/Au |
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:: Custom Metalizations and Thicknesses available upon request.
:: Standard Thick Film Wrap-Arounds
:: Special Thin Film Wrap-Arounds on special orders |
| Photopatterning: |
Custom patterning available to 0.0005" resolution. |
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| Thick Films: |
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Au
Pt/Au
Pd/Ag
Dielectric |
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