| Surface Characteristics Available: |
Lapped: |
16-22µinches
.0005 inch / inch Camber
+/- 0.0005" Thickness Tolerance |
Polished: |
1-2 µinches
<0.0005 mils/inch Camber
+/- 0.0005" Thickness Tolerance |
| Metalization Techniques Available: |
Thick Film: |
Gold, Platinum Gold
Silver, Pladium Silver,
Dielectric
Resistors less than 100 ohms/square |
Thin Film: |
Ti/Pt/Au
TiW/Au
Cr/Ni/Au
TaN/TiW/Au
NiCr/Ni/Au
Copper Plate-up |
Refractory: |
Molybdenum or Tungsten with Ni/Au Plating |
|
Thermal Conductivity
(W/mk) |
170
Coefficient of Thermal Expansion (ppm/c) |
4.6
Density (gm/cm3) |
3.28
Dielectric Constant
(@1ghz) |
8.8
Loss Tangent (@1ghz) |
0.0005 |
|
