Thin Film Design Guidelines

Sub Material Criteria:

I. Types:

• Al2O3: 96%, 99.5%, 99.6%
• Sapphire [100% Al2O3]
• BeO: 99.5% [Special-325W/mK]
• AlN [170W/mK or 200W/mK]

II. Sizes:

• Preferred Standard Length & Width
• Al2O3 @ 96%: 2"Sq., 2.25"Sq.
• Al2O3 @ 99.5%: 2"Sq.& 2.25"Sq.
• Al2O3 @ 99.6%: 4" Diameter
• Sapphire: 2" Diameter
• BeO: 2.06"Sq., 2.3"X2.9", 3.7"Sq.
• AlN: 2"Sq., 3"Sq. (Special: All types offer alternate sizes depending upon availability of material at time of order entry)
• Preferred Standard Thickness
• 0.010", 0.015", 0.025", 0.040"
• Lapped/Polished to Customer Request

III. Length & Width Tolerance:

• Diced Edge: Standard: ±0.002"
• Special: ±0.001"

IV. Thickness Tolerance:

• As Fired: ±10%
• Polished: ±0.0005"

V. Polished Surface Finishes:

• 96% Al2O3: 3µ-in Max
• 99% Al2O3: 1µ-in Max
• BeO: 4µ-in Max
• AlN: 2µ-in Max

Metalized Material Criteria:

I. THN Metals Offered:

• PVD Deposited (purpose):
• Ti: 1000-1500Å (Adhesion)
• NiCr: 1000-1500Å (Adhesion)
• Pt: 2000-3000Å (Barrier)
• Ni: 2000-3000Å (Barrier)
• Au: 1500-10,000Å
• PVD up to 10,000Å [1µm]
• Plating >1µm
• Cu: 20,000Å MIN.

II. Pattern Tolerance:

• Minimum Trace/Space Size: [Metal ThicknessX10] + 0.002"
• Metal Feature Size:
• Milled: ±0.0005" for <5000Å
• ±0.001" for >5000Å
• Liftoff: ±0.001"
• Etched: [Metal ThicknessX5] + 0.0005"
• Minimum Metal Pullback: As Fired Sub Edge: 0.100" | Diced Edge: Front Side: 0.001"±0.001"
• Back Side: 0.002"±0.002"
• Single Diced Critical Edge: 0.0004"±0.0004" or 0.0005"±0.0005"
• Laser Feature: 0.010"±0.005"

III. Finishes Available:

• Electroless or Electrolytic Ni:
• Standard: 50µ-in or 100µ-in Nominal
• Special: Upon Request
• Electroless or Electrolytic Au:
• Standard: (Flash) 4-10µ-in
• Special: Upon Request
• 40µ-in+: Requires pull test tab

• AuSn Coating
• Compositions: 75/25 or Requested
• Standard Thickness: 4 - 8µm
• Standard Thickness Tolerance: ±1µm
• Location Tolerance: ±0.002"
• Standard Barrier Metal: Pt: 5000Å
• Other Offered Barriers: Ti/Pt or Ni
• Au Overcoat Offered: 1000+200/-000Å
• Standard – Flush with Base Metal with potential for 0.004" overspray all edges
• Minimum Overlay Feature Size: 0.005"
• Laser Ablated Solder Dams: 0.010"±0.001"

IV. Thru-holes:

• Hole Size: Standard 1:1 Ratio | Between hole diameter & Ceramic thickness
• Special: Upon Request
• Minimum Distance Hole Edge to Diced Part Edge to be equal towhichever is larger between ceramic thickness or hole diameter
• See Laser Feature Pullback Criteria above